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South Korea's June semiconductor exports keep surging
DRAM, NAND, SSD, and HBM exports are all ripping higher, showing how quickly memory is re-rating
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JEDEC ratifies a new HBM standard
A new memory standard broadens HBM's addressable scope and can shift demand across the stack
58.
South Korea Preliminary Exports (June 1–20)
South Korea Preliminary Exports (June 1–20) - MLCC: +24% YoY, +23% MoM - Semiconductor Manufacturing Equipment: +38% YoY, +43% MoM
59.
South Korea Preliminary Exports (June 1–20)
South Korea Preliminary Exports (June 1–20) - DRAM (including modules): +342% YoY, +3% MoM - Flash Memory (NAND): +336% YoY, +28% MoM - SSD: +405% YoY, +25% MoM - MCP (HBM): +209% YoY, +51% MoM
65.
Korean media reported that CXMT employees who received equity incentives ahead of the company’s listing could end…
Korean media reported that CXMT employees who received equity incentives ahead of the company’s listing could end up holding shares worth hundreds of thousands of dollars per person. This is because CXMT granted large-scale equity awards i
84.
"Some neo-clouds worry that they can’t stray from buying Nvidia’s full stack of hardware for fear of being put in…
"Some neo-clouds worry that they can’t stray from buying Nvidia’s full stack of hardware for fear of being put in “Jensen jail,” meaning they might lose their allocations of Nvidia chips, said Adam Fisher, a partner at Bessemer Venture Part
11.
Samsung Foundry is reportedly developing Neuralink’s next chip on 4nm
A next-generation Neuralink chip moving through Samsung’s 4nm process would connect advanced foundry capacity directly to implantable neurotechnology
3.
Murata to raise power inductor prices 50%; Taiyo Yuden up to 150%
A broad price hike in power inductors points to a tight component bottleneck below the headline GPU and memory layers
60.
Marvell CEO says copper wall is moving inside the rack, and copackaged optics is the only way through
Marvell CEO says copper wall is moving inside the rack, and copackaged optics is the only way through • Marvell CEO Matt Murphy emphasized at Computex 2026 that the next bottleneck in AI infrastructure is not compute or memory but connect